A light emitting device can include a substrate including a top surface, an outermost side surface, and a bottom surface; a light emitting diode chip on the top surface of the substrate; a reflecting member disposed on a first portion of the top surface of the substrate and the reflecting member having a cavity; a first metal layer disposed on a second portion of the top surface, one side of the outermost side surface, and a first portion of the bottom surface; a second metal layer disposed on a third portion of the top surface, another side of the outermost side surface, and a second portion of the bottom surface; a heatsink disposed on the bottom surface of the substrate; and at least two heatsink holes in the substrate formed to pass through the substrate, in which the at least two heatsink holes are in contact with the heatsink, and a reflective material is on an inside surface of the at least two heatsink holes, the first metal layer, the second metal layer, and the heatsink are separated from each other on the bottom surface of the substrate, and the at least two heatsink holes are vertically overlapped with the light emitting diode chip and the heatsink.