Invention Grant
- Patent Title: Sensor component with cap over trench and sensor elements
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Application No.: US15950429Application Date: 2018-04-11
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Publication No.: US10693057B2Publication Date: 2020-06-23
- Inventor: Marc Baumann , Thilo Rubehn , Christian Joos , Jochen Stephan
- Applicant: TDK-Micronas GmbH
- Applicant Address: DE Freiburg
- Assignee: TDK-MICRONAS GMBH
- Current Assignee: TDK-MICRONAS GMBH
- Current Assignee Address: DE Freiburg
- Agency: 24IP Law Group USA, PLLC
- Agent Timothy R. DeWitt
- Main IPC: H01L29/82
- IPC: H01L29/82 ; H01L43/06 ; H01L43/04 ; G01R33/00 ; G01R33/07 ; H01L27/22 ; H01L25/04
Abstract:
A component is provided comprising at least one substrate, at least one magnetic field sensor and at least one trench in the at least one substrate surrounds the at least one magnetic field sensor at least partially. At least one cap covers the at least one trench and the at least one magnetic field sensor, and at least one layer element arranged between the at least one cap and the at least one substrate.
Public/Granted literature
- US20180233658A1 COMPONENT WITH REDUCED STRESS FORCES IN THE SUBSTRATE Public/Granted day:2018-08-16
Information query
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