Invention Grant
- Patent Title: Structural tank integrated into an electronic device case
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Application No.: US14517707Application Date: 2014-10-17
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Publication No.: US10693218B2Publication Date: 2020-06-23
- Inventor: Sidharath Jain , Nil Apaydin , Javier R. De Luis , Ben Shewan , Alireza Mahanfar , Paul O'Brien
- Applicant: Microsoft Corporation
- Applicant Address: US WA Redmond
- Assignee: Microsoft Technology Licensing, LLC
- Current Assignee: Microsoft Technology Licensing, LLC
- Current Assignee Address: US WA Redmond
- Agency: Holzer Patel Drennan
- Main IPC: H01Q1/50
- IPC: H01Q1/50 ; H01Q1/27 ; G06F1/16 ; H01Q1/48 ; H01Q13/10 ; H01Q13/18 ; G04R60/08 ; G04G21/04 ; H01Q5/328 ; H01Q1/36 ; H01Q5/392

Abstract:
An apparatus is provided with a conductive bezel section and a conductive ground plane section forming a perimeter and being positioned opposite the conductive bezel section. The conductive ground plane section is separated from the conductive bezel section by a perimeter gap at the perimeter. A structural tank circuit is integrated with and connecting the conductive bezel section and the conductive ground plane section across the perimeter gap. Another implementation may include a structural capacitor or a structural inductor integrated with and connecting the conductive bezel section and the conductive ground plane section across the perimeter gap.
Public/Granted literature
- US20160006110A1 STRUCTURAL TANK INTEGRATED INTO AN ELECTRONIC DEVICE CASE Public/Granted day:2016-01-07
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