Invention Grant
- Patent Title: Method for electrically connecting an electronic module and electronic assembly
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Application No.: US15981647Application Date: 2018-05-16
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Publication No.: US10693248B2Publication Date: 2020-06-23
- Inventor: Katharina Teichmann , Alexander Herbrandt
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@34b78017
- Main IPC: H01R12/58
- IPC: H01R12/58 ; H05K1/14 ; H01B1/02 ; H01R4/58 ; H01R12/52 ; H05K5/00 ; H01R13/03 ; H05K1/03

Abstract:
An electronic assembly has an electronic module and an electric part. The electronic module has an electric terminal having a press-fit section. The press-fit section includes at least one of the following CuFeP; CuZr; CuCrZr; CuMg; CuCrTiSi; CuCrAgFeTiSi; and CuNiSiMg. The electric part has a contact hole. The electronic assembly includes a press-fit connection between the press-fit section and the electric part. In that press-fit connection, the press-fit section both mechanically and electrically contacts the electric part.
Public/Granted literature
- US20180337475A1 Method for Electrically Connecting an Electronic Module and Electronic Assembly Public/Granted day:2018-11-22
Information query
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