A splice assembly for engaging a conductor includes a brush configured to engage the conductor. The brush includes a housing having a first portion and a second portion. The housing defines a housing axis extending between the first portion and the second portion. The first portion defines a cavity having an open end. The second portion defines a bore. A diameter of the cavity is larger than a diameter of the bore. The cavity and the bore are configured to receive the conductor therethrough. The brush further includes a brush member secured within the cavity and positioned proximate the open end.