Invention Grant
- Patent Title: Patch preparation
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Application No.: US15123517Application Date: 2015-02-24
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Publication No.: US10695335B2Publication Date: 2020-06-30
- Inventor: Satoshi Kawakami
- Applicant: Teikoku Seiyaku Co., Ltd.
- Applicant Address: JP Higashikagawa-shi
- Assignee: Teikoku Seiyaku Co., Ltd.
- Current Assignee: Teikoku Seiyaku Co., Ltd.
- Current Assignee Address: JP Higashikagawa-shi
- Agency: Crowell & Moring LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3be314ad
- International Application: PCT/JP2015/055173 WO 20150224
- International Announcement: WO2015/133329 WO 20150911
- Main IPC: A61F13/00
- IPC: A61F13/00 ; A61K31/445 ; A61K9/70 ; A61M37/00

Abstract:
Provided is a patch preparation that has improved adhesion to an adherend so as to enable a drug, especially, a systemically active drug to be stably and continuously administered over an extended period. The patch preparation has a layered structure comprising a patch layer including an adhesive plaster containing a drug and a patch support, and a cover layer in this order from a side attached to a skin. In the patch preparation, a buffer material is disposed between the patch support of the patch layer and the cover layer, the cover layer has a size covering an area beyond peripheral edges of the patch layer, and a shielding film is further disposed between the cover layer and the buffer material.
Public/Granted literature
- US20160367536A1 Patch Preparation Public/Granted day:2016-12-22
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