Invention Grant
- Patent Title: Bonding method using a carbon nanotube structure
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Application No.: US16119700Application Date: 2018-08-31
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Publication No.: US10696032B2Publication Date: 2020-06-30
- Inventor: Xiang Jin , Zi-Peng Wu , Wen-Tao Miao , Kai-Li Jiang , Shou-Shan Fan
- Applicant: Tsinghua University , HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: CN Beijing TW New Taipei
- Assignee: Tsinghua University,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: Tsinghua University,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Beijing TW New Taipei
- Agency: ScienBiziP, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7e2f6517
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B32B37/12 ; B32B5/16 ; B32B9/04 ; C09J7/38 ; C09J5/00 ; B32B7/03 ; C08J5/12 ; B82Y30/00 ; B82Y40/00 ; B29C65/02 ; B29C65/50 ; B29C65/76 ; B32B7/035

Abstract:
A bonding method utilizing carbon nanotubes provides first and second objects to be bonded and a carbon nanotube structure. The carbon nanotube structure comprises a super-aligned carbon nanotube film comprising carbon nanotubes, the carbon nanotubes extending substantially along a same direction. The carbon nanotube structure is laid on surface of first object and surface of second object is pressed onto the carbon nanotube structure. Pressure being applied to the first object and the second object bonds the two together.
Public/Granted literature
- US20190202190A1 BONDING METHOD USING A CARBON NANOTUBE STRUCTURE Public/Granted day:2019-07-04
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