Method for manufacturing cliché for offset printing, and cliché for offset printing

Invention Grant

US10696081B2 Method for manufacturing cliché for offset printing, and cliché for offset printing 有权

Patent Title: Method for manufacturing cliché for offset printing, and cliché for offset printing
Application No.: US15536046

Application Date: 2016-08-26
Publication No.: US10696081B2

Publication Date: 2020-06-30
Inventor: Yong Goo Son , Seung Heon Lee
Applicant: LG CHEM, LTD.
Applicant Address: KR Seoul
Assignee: LG CHEM, LTD.
Current Assignee: LG CHEM, LTD.
Current Assignee Address: KR Seoul
Agency: Dentons US LLP
Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7209df35
International Application: PCT/KR2016/009529 WO 20160826
International Announcement: WO2017/034372 WO 20170302
Main IPC: H01L21/027
IPC: H01L21/027 ; B41N1/06 ; H01L21/67 ; H01L21/033 ; H01L21/02 ; H01L21/768 ; G03F7/20 ; B41C1/00 ; G03F7/038 ; G03F7/32 ; G03F7/40

Abstract:

The present invention relates to a method for manufacturing a cliché for offset printing and a cliché for offset printing.

Public/Granted literature

Information query

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/027	..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜