Invention Grant
- Patent Title: Conductive paste for bonding
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Application No.: US15704456Application Date: 2017-09-14
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Publication No.: US10696875B2Publication Date: 2020-06-30
- Inventor: Yumi Matsuura
- Applicant: E I DU PONT DE NEMOURS AND COMPANY
- Applicant Address: US DE Wilmington
- Assignee: E. I. DU PONT DE NEMOURS AND COMPANY
- Current Assignee: E. I. DU PONT DE NEMOURS AND COMPANY
- Current Assignee Address: US DE Wilmington
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2d4a0291 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1f22eb2a
- Main IPC: B23K35/02
- IPC: B23K35/02 ; C09J9/02 ; C08L1/28 ; C09J5/06 ; C09J11/04 ; C09J11/06 ; C09J101/28 ; H01L23/00 ; C08K3/08
Abstract:
The present invention relates to a conductive paste for bonding comprising 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.
Public/Granted literature
- US20180072923A1 Conductive Paste For Bonding Public/Granted day:2018-03-15
Information query
