A plating device comprising: a water tank into which a plating solution is poured; a tubular nozzle being disposed in the water tank and serving as an anode; a to-be-plated object being disposed in the water tank so as to be opposed to the nozzle and serving as a cathode; a direct-current power source to apply a voltage between the nozzle and the to-be-plated object; and a pump to circulate the plating solution such that the plating solution poured into the water tank passes through the nozzle and is ejected onto the to-be-plated object. A perforated plate member, which includes a through-hole having a smaller diameter than the inside diameter of the nozzle, is arranged on the inflow side of the nozzle such that the through-hole is opposed to an open region of the nozzle.