Invention Grant
- Patent Title: Metrology inspection apparatus
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Application No.: US15574174Application Date: 2016-05-29
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Publication No.: US10697908B2Publication Date: 2020-06-30
- Inventor: Doron Reinis , Michael Geffen , Roni Peretz , Colin Smith
- Applicant: XWINSYS LTD.
- Applicant Address: IL Migdal Haemek
- Assignee: XWINSYS LTD.
- Current Assignee: XWINSYS LTD.
- Current Assignee Address: IL Migdal Haemek
- Agency: Law Offices of Steven W. Weinrieb
- International Application: PCT/IL2016/050555 WO 20160529
- International Announcement: WO2016/193968 WO 20161208
- Main IPC: G01N23/223
- IPC: G01N23/223 ; G01N23/2206 ; G01N23/207 ; G02B21/00

Abstract:
The present disclosure provides a method and an apparatus for apparatus for inspecting a semiconductor wafer for abnormalities by accurately measuring elemental concentration at a target area. The apparatus includes an x-ray imaging subsystem for measuring an elemental composition at the target area of the semiconductor wafer. The apparatus further includes an edxrf subsystem for measuring an elemental concentration at the target area of the semiconductor wafer. The elemental concentration may be calibrated by first correlating the elemental concentration measurements obtained using x-ray imaging system for the target area with the elemental concentration measurements obtained using the edxrf subsystem for the target area to receive an augmented and accurate elemental concentration measurement for the target area of the semiconductor wafer.
Public/Granted literature
- US20180128757A1 METROLOGY INSPECTION APPARATUS Public/Granted day:2018-05-10
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