Invention Grant
- Patent Title: Accelerometer techniques to compensate package stress
-
Application No.: US15439516Application Date: 2017-02-22
-
Publication No.: US10697994B2Publication Date: 2020-06-30
- Inventor: Cenk Acar , Brenton Ross Simon , Sandipan Maity
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Brake Hughes Bellermann LLP
- Main IPC: G01P15/125
- IPC: G01P15/125 ; G01P15/18 ; G01P15/08

Abstract:
Techniques for compensating package stress of a proof mass are provided. In an example, a proof mass can be suspended from a substrate by a proof mass anchor. The first proof mass can have a major surface that defines a first plane. Portions of electrodes forming part of the proof mass can be symmetric with each other across a first line, wherein the first line bisects the first proof mass anchor, extends parallel to the first plane and extends between the first electrode and the second electrode.
Public/Granted literature
- US20180238925A1 ACCELEROMETER TECHNIQUES TO COMPENSATE PACKAGE STRESS Public/Granted day:2018-08-23
Information query
IPC分类: