Invention Grant
- Patent Title: Chip
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Application No.: US16367886Application Date: 2019-03-28
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Publication No.: US10698029B2Publication Date: 2020-06-30
- Inventor: Sheng-Ping Yung , Pei-Ying Hsueh , Chun-Yi Kuo
- Applicant: REALTEK SEMICONDUCTOR CORP.
- Applicant Address: TW Hsinchu
- Assignee: REALTEK SEMICONDUCTOR CORP.
- Current Assignee: REALTEK SEMICONDUCTOR CORP.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@42509863
- Main IPC: G01R31/3177
- IPC: G01R31/3177 ; G01R31/317

Abstract:
A chip includes one or more function input pads, a sequence generation circuit, one or more logic circuits, one or more scan chains, a selection circuit, and one or more sequence output pads. The function input pad is configured to receive a function sequence. The sequence generation circuit is configured to generate a diagnosis sequence. The logic circuit includes a plurality of logic gates, for responding to the function sequence and outputting one or more logic results. When enabled by the selection circuit, the scan chain outputs a response result in response to the logic result or a diagnosis result in response to the diagnosis sequence. The sequence output pad receives the diagnosis result when the scan chain responds to the diagnosis sequence.
Public/Granted literature
- US20200124666A1 CHIP Public/Granted day:2020-04-23
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