Invention Grant
- Patent Title: Thermal management system for vehicle power inductor assembly
-
Application No.: US15810666Application Date: 2017-11-13
-
Publication No.: US10699840B2Publication Date: 2020-06-30
- Inventor: Myung Ki Sung , Edward Chan-Jiun Jih , Michael W. Degner
- Applicant: Ford Global Technologies, LLC
- Applicant Address: US MI Dearborn
- Assignee: Ford Global Technologies, LLC
- Current Assignee: Ford Global Technologies, LLC
- Current Assignee Address: US MI Dearborn
- Agency: Brooks Kushman, P.C.
- Agent David Kelley
- Main IPC: H01F27/10
- IPC: H01F27/10 ; H01F27/28 ; H01F37/00 ; H01F27/40

Abstract:
A power inductor assembly including a power inductor, a vehicle component, and a pair of distribution conduits is provided. The power inductor has a housing supporting a pair of coils. The vehicle component is located above the pair of coils. Each of the pair of distribution conduits is oriented relative to one of the pair of coils below the vehicle component and has one or more openings adjacent the coils to distribute coolant thereto. Each of the one or more openings may define one of a circular shape or a slot shape. Each of the one or more openings may be sized such that exiting coolant substantially uniformly covers the adjacent coil.
Public/Granted literature
- US20190148054A1 Thermal Management System for Vehicle Power Inductor Assembly Public/Granted day:2019-05-16
Information query