A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a body having internal electrodes stacked to face each other and a plurality of dielectric layers interposed therebetween, and first and second external electrodes disposed on both end portions of the body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor, wherein the ceramic chip has a double-step shape and includes two ceramic chips having different lengths to each other and coupled in a thickness direction of the ceramic chip.