Invention Grant
- Patent Title: Method for creating a fully self-aligned via
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Application No.: US16425020Application Date: 2019-05-29
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Publication No.: US10699953B2Publication Date: 2020-06-30
- Inventor: Amrita B. Mullick , Nitin K. Ingle , Xikun Wang , Regina Freed , Uday Mitra , Ho-yung David Hwang
- Applicant: Micromaterials LLC
- Applicant Address: US DE Wilmington
- Assignee: Micromaterials LLC
- Current Assignee: Micromaterials LLC
- Current Assignee Address: US DE Wilmington
- Agency: Servilla Whitney LLC
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/522 ; H01L21/311 ; H01L23/532

Abstract:
Apparatuses and methods to provide a fully self-aligned via are described. Some embodiments of the disclosure provide an electronic device having a liner that is selectively removable when compared to conductive lines. The liner may be selectively removed by utilizing one or more of a base (e.g. sodium hydroxide) and hydrogen peroxide.
Public/Granted literature
- US20190378756A1 Method For Creating A Fully Self-Aligned Via Public/Granted day:2019-12-12
Information query
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