Invention Grant
- Patent Title: Film for package substrate, semiconductor package, display device, and methods of fabricating the film, the semiconductor package, the display device
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Application No.: US16115751Application Date: 2018-08-29
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Publication No.: US10699974B2Publication Date: 2020-06-30
- Inventor: So Young Lim , Ye Chung Chung
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee IP Law, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@36afff34 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@b4a7875
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L23/498 ; H01L23/00 ; H05K1/03 ; H05K1/02 ; G09G3/00

Abstract:
A display device including a film substrate including first and second surfaces, the first surface being opposite to the second surface; a semiconductor chip disposed on the first surface and including an input terminal and a test terminal, which are arranged in a first direction; a first wire extending from the input terminal on the first surface along a second direction, which intersects the first direction; and a second wire including a first extended portion, which extends along the first surface, a second extended portion, which extends along the second surface, and a first via, which penetrates the film substrate and connects the first extended portion and the second extended portion, wherein the first extended portion extends from the test terminal in the second direction and is connected to the first via, and the second extended portion extends from the first via to an edge of the second surface.
Public/Granted literature
Information query
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