Invention Grant
- Patent Title: Packaged light emitting devices including electrode isolation structures and methods of forming packaged light emitting devices including the same
-
Application No.: US15841937Application Date: 2017-12-14
-
Publication No.: US10699991B2Publication Date: 2020-06-30
- Inventor: Chi-Goo Kang , Sun-Woo Kim , Jong-Sup Song , Ho-Young Song
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@233d6e23
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L33/44 ; H01L23/00 ; H01L33/38 ; H01L33/48 ; H01L33/62 ; H01L23/48
Abstract:
A packaged light emitting device can include a mounting substrate including first and second electrode portions that are separated by a recess defined by a first side surface of the first electrode portion and a second side surface of the second electrode portion that is opposite the first side surface. An insulation support member can partially fill a lower portion of the recess to partially cover the first side surface and partially cover the second side surface. A light emitting device can be coupled to the first and second electrode portions of the mounting substrate and a sealing member can be on the mounting substrate covering the light emitting device.
Public/Granted literature
Information query
IPC分类:
