Invention Grant
- Patent Title: Semiconductor device having bonding regions exposed through protective films provided on circuit patterns onto which components are soldered
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Application No.: US15909963Application Date: 2018-03-01
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Publication No.: US10699994B2Publication Date: 2020-06-30
- Inventor: Kenshi Kai , Rikihiro Maruyama
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-Shi, Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi, Kanagawa
- Agency: Rabin & Berdo, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@67944792
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L23/498 ; H01L23/00 ; H05K3/34 ; H05K3/24 ; H05K3/40 ; H01L25/07 ; H01L23/053
Abstract:
In a semiconductor device, protective films are formed on facing side surfaces of a plurality of circuit patterns and a plating process or the like is not performed on parts aside from the side surfaces where the protective films are formed. This means that when semiconductor elements and contact elements are directly bonded via solder onto the plurality of circuit patterns, a drop-in wettability of the plurality of circuit patterns for the solder is avoided.
Public/Granted literature
- US20190006272A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-01-03
Information query
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