A fan-out semiconductor package includes: a core member having a through-hole; a semiconductor chip disposed in the through-hole of the core member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant covering at least portions of the core member and the semiconductor chip and filling at least portions of the through-hole; and a connection member disposed on the core member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads. The core member has a recess portion penetrating through at least portions of the core member, and at least a portion of the recess portion is filled with the encapsulant.