A semiconductor device includes: a first semiconductor element; a first conductor plate laminated on the first semiconductor element and connected to the first semiconductor element; a first power terminal connected to the first conductor plate, the first power terminal including a body portion extending in a first direction and a joining portion extending in a second direction different from the first direction, the joining portion being connected to the first conductor plate; and a sealing body configured to seal the first semiconductor element, the first conductor plate, the joining portion, and a part of the body portion, the sealing body having a first surface that is a surface from which the body portion projects and a second surface that is a surface placed on an opposite side of the sealing body from the first surface.