Invention Grant
- Patent Title: Solid-state imaging device
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Application No.: US15631283Application Date: 2017-06-23
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Publication No.: US10700108B2Publication Date: 2020-06-30
- Inventor: Kosei Tamiya
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/33 ; H04N5/369

Abstract:
A solid-state imaging device includes a first semiconductor substrate in which first photoelectric conversion layers photoelectrically converting incident light in a first wavelength band are formed, a second semiconductor substrate in which second photoelectric conversion layers photoelectrically converting incident light are formed, a conductive layer disposed between the first semiconductor substrate and the second semiconductor substrate and having conductivity, an insulation film disposed between the second semiconductor substrate and the conductive layer and having an insulation property, in which light passing through the first photoelectric conversion layer, the conductive layer, and the insulation film is incident on the second semiconductor substrate, a predetermined voltage is applied to the conductive layer, and a wavelength of light in a second wavelength band photoelectrically converted by the second photoelectric conversion layer when the predetermined voltage is applied to the conductive layer is longer than when the predetermined voltage is not applied.
Public/Granted literature
- US20170294467A1 SOLID-STATE IMAGING DEVICE Public/Granted day:2017-10-12
Information query
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