Invention Grant
- Patent Title: Split-gate flash memory, method of fabricating same and method for control thereof
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Application No.: US16232487Application Date: 2018-12-26
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Publication No.: US10700174B2Publication Date: 2020-06-30
- Inventor: Xianzhou Liu
- Applicant: Shanghai Huahong Grace Semiconductor Manufacturing Corporation
- Applicant Address: CN Shanghai
- Assignee: Shanghai Huahong Grace Semiconductor Manufacturing Corporation
- Current Assignee: Shanghai Huahong Grace Semiconductor Manufacturing Corporation
- Current Assignee Address: CN Shanghai
- Agency: Murtha Cullina LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1f50a5f
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L21/28 ; G11C16/04 ; G11C16/14 ; G11C16/26 ; H01L21/3213 ; H01L27/11521 ; H01L29/66 ; H01L29/788 ; G11C16/08

Abstract:
A split-gate flash memory, a method of fabricating the split-gate flash memory and a method for control thereof are disclosed. The split-gate flash memory includes: a semiconductor substrate including a first memory region and a second memory region that are separate from each other; and a word-line structure between the first memory region and the second memory region. The word-line structure includes, stacked on the surface of the semiconductor substrate sequentially from bottom to top, a word-line oxide layer, a read gate, a dielectric oxide layer and an erase gate. The read and erase gates can each function as a word line of the split-gate flash memory for enabling a read or erase operation. During the erase operation, a voltage applied on the erase gate has an insignificant impact on the underlying semiconductor substrate, which is helpful in reducing channel leakage in the semiconductor substrate.
Public/Granted literature
- US20190355824A1 SPLIT-GATE FLASH MEMORY, METHOD OF FABRICATING SAME AND METHOD FOR CONTROL THEREOF Public/Granted day:2019-11-21
Information query
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