Invention Grant
- Patent Title: Silicon-controlled rectifier structure and manufacturing method thereof
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Application No.: US16192818Application Date: 2018-11-16
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Publication No.: US10700186B2Publication Date: 2020-06-30
- Inventor: Tianzhi Zhu
- Applicant: Shanghai Huali Microelectronics Corporation
- Agency: Kilpatrick Townsend & Stockton, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5fe01061
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/74 ; H01L29/66 ; H01L29/06

Abstract:
The present disclosure provides a silicon-controlled rectifier structure and a manufacturing method therefor. The silicon-controlled rectifier structure comprises a substrate; and an N-Well and a P-Well in the substrate, wherein an N-type heavily-doped region 410 and a P-type heavily-doped region 422 which are connected to an anode are provided in the N-Well, and a floating guard ring 416 is further provided in the N-Well between the N-type heavily-doped region 410 and the P-type heavily-doped region 422, the guard ring being spaced from the N-type heavily-doped region 410 by a shallow trench isolation, and an active area having a predetermined width exists between the guard ring and the P-type heavily-doped region 422; and an N-type heavily-doped region 414 and a P-type heavily-doped region 424 which are connected to a cathode are provided in the P-Well.
Public/Granted literature
- US20200058781A1 SILICON-CONTROLLED RECTIFIER STRUCTURE AND MANUFACTURING METHOD THEREFOR Public/Granted day:2020-02-20
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