Invention Grant
- Patent Title: Semiconductor device, and manufacturing method for same
-
Application No.: US15531385Application Date: 2015-11-19
-
Publication No.: US10700210B2Publication Date: 2020-06-30
- Inventor: Tetsuo Kikuchi , Hajime Imai , Hisao Ochi , Tetsuo Fujita , Hideki Kitagawa , Masahiko Suzuki , Shingo Kawashima , Tohru Daitoh
- Applicant: Sharp Kabushiki Kaisha
- Applicant Address: JP Sakai, Osaka
- Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee Address: JP Sakai, Osaka
- Agency: ScienBiziP, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6687324a
- International Application: PCT/JP2015/082500 WO 20151119
- International Announcement: WO2016/084688 WO 20160602
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L27/12 ; H01L29/66 ; H01L29/49 ; H01L29/417 ; H01L29/423 ; G02F1/1368 ; H01L21/28 ; G02F1/1362 ; H01L21/02 ; G02F1/1345 ; G02F1/1333

Abstract:
A semiconductor device includes a substrate and a thin film transistor supported by the substrate. The thin film transistor includes a gate electrode, an oxide semiconductor layer, a gate insulating layer provided between the gate electrode and the oxide semiconductor layer, and source and drain electrodes electrically connected to the oxide semiconductor layer. The gate insulating layer includes a first portion which is covered with the oxide semiconductor layer and a second portion which is adjacent to the first portion and which is not covered with any of the oxide semiconductor layer, the source electrode and the drain electrode. The second portion is smaller in thickness than the first portion, and the difference in thickness between the second portion and the first portion is more than 0 nm and not more than 50 nm.
Public/Granted literature
- US20170358674A1 SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME Public/Granted day:2017-12-14
Information query
IPC分类: