Invention Grant
- Patent Title: Semiconductor device, semiconductor wafer, module, electronic device, and manufacturing method thereof
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Application No.: US15416112Application Date: 2017-01-26
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Publication No.: US10700212B2Publication Date: 2020-06-30
- Inventor: Hiromi Sawai , Akihisa Shimomura
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2439bfdf
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/786 ; H01L27/06 ; H01L21/84 ; H01L21/8258 ; H01L27/088 ; H01L27/12 ; H01L21/02 ; H01L23/522 ; H01L23/528 ; H01L23/544 ; H01L27/32 ; H01L29/66 ; H01L27/092

Abstract:
A semiconductor device includes a first insulator, a transistor over the first insulator, a second insulator over the transistor, and a third insulator over the second insulator. The transistor includes an oxide semiconductor. The amount of oxygen released from the second insulator when converted into oxygen molecules is larger than or equal to 1×1014 molecules/cm2 and smaller than 1×1016 molecules/cm2 in thermal desorption spectroscopy at a surface temperature of a film of the second insulator of higher than or equal to 50° C. and lower than or equal to 500° C. The second insulator includes oxygen, nitrogen, and silicon.
Public/Granted literature
- US20170222056A1 SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER, MODULE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-08-03
Information query
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