An AlN Schottky barrier diode device on sapphire substrates is formed using metal organic chemical vapor deposition and demonstrates a kV-level breakdown voltage. The device structure employs a thin n-AlN epilayer as the device active region and thick resistive AlN underlayer as the insulator. At room temperature, the device was characterized by a low turn-on voltage of 1.2 V, a high on/off ratio of ˜105, a low ideality factor of 5.5, and a low reverse leakage current below 1 nA. Due to the ultra-wide bandgap of AlN, the device also exhibited excellent thermal stability over 500 K representing, therefore, a cost-effective route to high performance AlN based Schottky barrier diodes for high power, high voltage and high temperature applications.