Invention Grant
- Patent Title: Radio-frequency circuit
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Application No.: US16375866Application Date: 2019-04-05
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Publication No.: US10700715B2Publication Date: 2020-06-30
- Inventor: Atsushi Takada
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@73224cdb
- Main IPC: H04B1/00
- IPC: H04B1/00 ; H04B1/48

Abstract:
First and second frequency bands used for multiband communication are both higher than or equal to about 3 GHz, and do not overlap each other. The spacing between the first and second frequency bands is less than or equal to about 10% of the lower one of the lower-bound frequency of the first frequency band and the lower-bound frequency of the second frequency band. A radio-frequency circuit includes a first antenna, a second antenna, a first multiplexer connected to the first antenna, and a second multiplexer connected to the second antenna. The first multiplexer includes a first filter with a pass band including the first frequency band, and a third filter with a pass band different from the first filter. The second multiplexer includes a second filter with a pass band including the second frequency band, and a fourth filter with a pass band that differs from the second filter.
Public/Granted literature
- US20190356344A1 RADIO-FREQUENCY CIRCUIT Public/Granted day:2019-11-21
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