Invention Grant
- Patent Title: Internet of things (“IoT”) multi-layered embedded handshake
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Application No.: US15916395Application Date: 2018-03-09
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Publication No.: US10700867B2Publication Date: 2020-06-30
- Inventor: Manu Kurian
- Applicant: Bank of America Corporation
- Applicant Address: US NC Charlotte
- Assignee: Bank of America Corporation
- Current Assignee: Bank of America Corporation
- Current Assignee Address: US NC Charlotte
- Agency: Weiss & Arons LLP
- Agent Michael A. Springs, Esq.
- Main IPC: H04L9/32
- IPC: H04L9/32 ; H04L9/08 ; H04L29/06 ; H04L12/26 ; H04L29/08

Abstract:
Methods for securing data transmission are provided. Methods include utilizing a plurality of cross-connect tokens. Methods include receiving a communication line validation communication at a source device. Methods include powering a first passive cross-connect token located at the source device. The first passive cross-connect token may draw power from the communication. The first token may generate a first OTSC (“onetime security code”). The first token may transmit the first OTSC to a second token. The first OTSC may power the second token. The second token may validate the first OTSC, and generate a second OTSC. The second token may transmit the second OTSC to a third token. The third token may be located on a target device. The second OTSC may power the third token. The third token may validate the second OTSC, and transmit, upon validation, a communication line validated communication to the source device.
Public/Granted literature
- US20190280867A1 INTERNET OF THINGS ("IOT") MULTI-LAYERED EMBEDDED HANDSHAKE Public/Granted day:2019-09-12
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