Invention Grant
- Patent Title: Sound absorbing assembly for speaker module and speaker module
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Application No.: US16098678Application Date: 2016-12-29
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Publication No.: US10701475B2Publication Date: 2020-06-30
- Inventor: Aliang Chen , Guangfu Liu
- Applicant: Goertek Inc.
- Applicant Address: CN Shandong
- Assignee: Goertek Inc.
- Current Assignee: Goertek Inc.
- Current Assignee Address: CN Shandong
- Agency: Fox Rothschild LLP
- Agent Carol E. Thorstad-Forsyth
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@151c6918
- International Application: PCT/CN2016/113239 WO 20161229
- International Announcement: WO2017/197895 WO 20171123
- Main IPC: H04R1/28
- IPC: H04R1/28 ; H04R1/02

Abstract:
A sound absorbing assembly for a loudspeaker module and a loudspeaker module are disclosed. The sound absorbing assembly comprises a holding shell, the holding shell is provided with a receiving trough, the receiving trough is filled with a sound absorbing material, the holding shell is fixed within a rear vocal cavity of the loudspeaker module by injection molding, a bottom of the receiving trough is provided with sound penetration holes, and an interior of the receiving trough communicates with the rear vocal cavity via the sound penetration holes. The sound absorbing assembly is provided with a receiving trough on the holding shell, and the sound penetration holes of the receiving trough form sound transmission channels, to enable the sound absorbing material placed within the receiving trough to perform the sound absorbing function, to improve the acoustic quality of the loudspeaker.
Public/Granted literature
- US20190141436A1 Sound Absorbing Assembly for Speaker Module and Speaker Module Public/Granted day:2019-05-09
Information query
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