Composition for producing fillers and method for producing and processing the fillers
Abstract:
A composition for producing a putty. The composition includes a binder component with 40 to 95 wt.-% of an epoxy resin based on a total mass of the binder component, a hardener component with 5 to 70 wt.-% of an NH-group-containing compound relative to a total mass of the hardener component, and 0.1 to 15 wt.-% of synthetic hollow bodies based on a total mass of the putty. The synthetic hollow bodies have a density of 0.005 to 0.8 g/cm3.
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