Invention Grant
- Patent Title: Polishing pad and polishing apparatus
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Application No.: US15863552Application Date: 2018-01-05
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Publication No.: US10702970B2Publication Date: 2020-07-07
- Inventor: Chung-Chih Feng , I-Peng Yao , Lyang-Gung Wang , Wei-Te Liu , Wen-Chieh Wu , Yung-Chang Hung
- Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
- Applicant Address: TW Kaohsiung
- Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
- Current Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
- Current Assignee Address: TW Kaohsiung
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@404048a5
- Main IPC: B24B37/22
- IPC: B24B37/22 ; B24D3/32 ; B24B37/24 ; H01L21/306
Abstract:
The present invention relates to a polishing having a polishing layer, an elastic base layer and a binder layer. The binder layer binds the elastic base layer to the polishing layer. A compressibility of the elastic base layer is greater than a compressibility of the polishing layer. The present invention further provides a polishing apparatus and a method for polishing a substrate.
Public/Granted literature
- US20180193974A1 POLISHING PAD AND POLISHING APPARATUS Public/Granted day:2018-07-12
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