Invention Grant
- Patent Title: Injection molding system
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Application No.: US15173985Application Date: 2016-06-06
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Publication No.: US10703033B2Publication Date: 2020-07-07
- Inventor: Wataru Shiraishi
- Applicant: FANUC Corporation
- Applicant Address: JP Yamanashi
- Assignee: FANUC CORPORATION
- Current Assignee: FANUC CORPORATION
- Current Assignee Address: JP Yamanashi
- Agency: Hauptman Ham, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@46f0b093
- Main IPC: B29C45/17
- IPC: B29C45/17 ; B29C45/03 ; B29C45/20 ; B29C45/26 ; B29C45/42 ; B29C45/74 ; B29C45/76 ; B29C45/78 ; B29K23/00
Abstract:
An injection molding system includes a sensor that detects a state of a purged molding material, and a purged material analysis unit that obtains a detection signal of the sensor and analyzes the purged molding material. Whether or not the purge operation is completed is determined based on the detection signal of the sensor so as to complete the purge operation. The purge operation is thus allowed to be completed with a minimum purge amount.
Public/Granted literature
- US20160361855A1 INJECTION MOLDING SYSTEM Public/Granted day:2016-12-15
Information query
