Invention Grant
- Patent Title: Method and apparatus for heat-dissipation in electronics
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Application No.: US15335773Application Date: 2016-10-27
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Publication No.: US10703490B2Publication Date: 2020-07-07
- Inventor: Michel Engelhardt , Christopher Mouris Astefanous
- Applicant: GE AVIATION SYSTEMS, LLC
- Applicant Address: US MI Grand Rapids
- Assignee: GE Aviation Systems LLC
- Current Assignee: GE Aviation Systems LLC
- Current Assignee Address: US MI Grand Rapids
- Agency: McGarry Bair PC
- Main IPC: B64D13/08
- IPC: B64D13/08 ; H05K7/20

Abstract:
A method and apparatus for heat-dissipation utilizing a fin assembly including one or more fins organized on a wall or base surface. The fins can extend into a flow of fluid passing along the wall or base surface to convectively cool the fins, which can transfer heat from heat-producing components, such as electronics.
Public/Granted literature
- US20180124953A1 METHOD AND APPARATUS FOR HEAT-DISSIPATION IN ELECTRONICS Public/Granted day:2018-05-03
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