Invention Grant
- Patent Title: Ablative material with a polymeric phosphorylated amide
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Application No.: US15446844Application Date: 2017-03-01
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Publication No.: US10703899B2Publication Date: 2020-07-07
- Inventor: Michele L. Chaffey , Arthur Rojo
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Yee & Associates, P.C.
- Main IPC: C08K5/49
- IPC: C08K5/49 ; C08L61/06 ; B64G1/58 ; C08L61/04 ; B29C67/24 ; B32B17/10 ; B32B27/08 ; B32B27/20 ; B32B27/34 ; B32B27/42 ; B29K61/04
Abstract:
An ablative material comprises a phenolic resin, a polymeric phosphorylated amide, and a number of fillers. The polymeric phosphorylated amide is in the ratio of between 1 and 10 parts of the polymeric phosphorylated amide per 100 parts of phenolic resin or resin solids, by weight.
Public/Granted literature
- US20180251632A1 Ablative Material with a Polymeric Phosphorylated Amide Public/Granted day:2018-09-06
Information query
