A thermoplastic resin composition of the present invention comprises: (A) about 20 to about 70% by weight of an aromatic polyamide resin comprising at least two aromatic dicarboxylic acid units; (B) about 0.1 to about 20% by weight of an olefin-based copolymer; and (C) about 10% to about 60% by weight of an inorganic filler. The thermoplastic resin composition and a molded article produced therefrom are excellent in plateability, impact resistance, heat resistance and the like.