Invention Grant
- Patent Title: Acrylic composition for sealing, sheet material, multilayer sheet, cured product, semiconductor device and method for manufacturing semiconductor device
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Application No.: US16318429Application Date: 2017-07-21
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Publication No.: US10703939B2Publication Date: 2020-07-07
- Inventor: Kazuki Watanabe , Shigeru Yamatsu , Naoki Kanagawa , Daisuke Sasaki
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@f5275e6
- International Application: PCT/JP2017/026418 WO 20170721
- International Announcement: WO2018/030113 WO 20180215
- Main IPC: C09J7/35
- IPC: C09J7/35 ; C09J4/06 ; C09J5/06 ; H01L21/48 ; H01L21/56 ; H01L21/78 ; H01L23/29 ; H01L23/31 ; H01L23/498 ; H01L23/00
Abstract:
The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, a thermal radical polymerization initiator, and a thermoplastic resin.
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