Invention Grant
- Patent Title: Thermally conductive sheet
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Application No.: US15888249Application Date: 2018-02-05
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Publication No.: US10703952B2Publication Date: 2020-07-07
- Inventor: Toyokazu Ito , Masaya Miyamura , Gen Kobayashi
- Applicant: ZEON CORPORATION
- Applicant Address: JP Chiyoda-ku, Tokyo
- Assignee: ZEON CORPORATION
- Current Assignee: ZEON CORPORATION
- Current Assignee Address: JP Chiyoda-ku, Tokyo
- Agency: Kenja IP Law PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@ad85d5f
- Main IPC: C08L27/12
- IPC: C08L27/12 ; C08L27/14 ; C08L27/16 ; C08L27/18 ; C08L27/20 ; C09K5/14

Abstract:
A thermally conductive sheet includes a resin that is liquid under normal temperature and pressure, a resin that is solid under normal temperature and pressure, and a particulate carbon material, and the thermal resistance of the thermally conductive sheet under a pressure of 0.05 MPa is at most 0.30° C/W. In the thermally conductive sheet, the resin that is solid under normal temperature and pressure is preferably a thermoplastic fluororesin that is solid under normal temperature and pressure, and the resin that is liquid under normal temperature and pressure is preferably a thermoplastic fluororesin that is liquid under normal temperature and pressure.
Public/Granted literature
- US20180223147A1 THERMALLY CONDUCTIVE SHEET Public/Granted day:2018-08-09
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