Invention Grant
- Patent Title: Process kit design for in-chamber heater and wafer rotating mechanism
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Application No.: US15421964Application Date: 2017-02-01
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Publication No.: US10704147B2Publication Date: 2020-07-07
- Inventor: Muhammad M. Rasheed , Muhannad Mustafa , Hamid Tavassoli , Steven V Sansoni , Cheng-Hsiung Tsai , Vikash Banthia
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C16/46 ; C23C16/458 ; H01L21/687 ; H01L21/67 ; H01L21/683

Abstract:
Embodiments of the present disclosure are directed process kits for use with an in-chamber heater and substrate rotating mechanism. In some embodiments consistent with the present disclosure, a process kit for use with a rotatable substrate support heater pedestal for supporting a substrate in a process chamber may include an upper edge ring including a top ledge and a skirt the extends downward from the top ledge, a lower edge ring that at least partially supports the upper edge ring and aligns the upper edge ring with the substrate support heater pedestal, a bottom plate disposed on a bottom of the process chamber that supports the upper edge ring when the substrate support heater pedestal is in a lowered non-processing position, and a shadow ring that couples with the upper edge ring when the substrate support heater pedestal is in a raised processing position.
Public/Granted literature
- US20180155838A1 PROCESS KIT DESIGN FOR IN-CHAMBER HEATER AND WAFER ROTATING MECHANISM Public/Granted day:2018-06-07
Information query
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