A method for processing a substrate in a substrate processing system includes selectively delivering at least one of a precursor, a deposition carrier gas, and a post deposition purge gas to a processing chamber. The method includes depositing film on the substrate by generating radio frequency (RF) plasma in the processing chamber between an upper electrode and a lower electrode while supplying an RF voltage to one of the upper electrode and the lower electrode and while the precursor and the deposition carrier gas is delivered. The method includes selectively supplying a direct current (DC) bias voltage to the upper electrode or the lower electrode; moving the substrate relative to a pedestal supporting the substrate while generating the DC bias voltage; and delivering the post deposition purge gas while supplying at least a portion of the DC bias voltage to the upper electrode or the lower electrode.