Invention Grant
- Patent Title: Method of metal polishing and oxidation film process and system thereof
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Application No.: US15425143Application Date: 2017-02-06
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Publication No.: US10704159B2Publication Date: 2020-07-07
- Inventor: Kun Cheng Peng , Bo Yan Su , Wei Chun Wang , Chun Ying Lee
- Applicant: Kun Cheng Peng , Bo Yan Su , Wei Chun Wang , Chun Ying Lee
- Agency: Sinorica, LLC
- Main IPC: C25F3/16
- IPC: C25F3/16 ; C25F5/00 ; C25F7/00 ; B23H3/02

Abstract:
The present invention is a method of metal polishing and oxidation film process applied on a metal workpiece. The process comprises (a) providing the metallic workpiece in an electrolysis polishing liquid; (b) a temperature control device controlling a liquid temperature of the electrolysis polishing liquid; (c) a voltage supply device to exercising an operating voltage between the metallic workpiece and the electrolysis polishing liquid; (d) polishing the surface of the metallic workpiece and forming an oxidation layer by regulating the temperature control device and the voltage supply device; and (e) determining a film thickness of the oxidation layer formed on the metallic workpiece according to an operation time, wherein the film thickness is related to a roughness and a color displayed on the metallic workpiece. The metallic workpiece may be dyed together during the polishing process without adding any dyes. The present invention further provides a system of alloy oxidation film process.
Public/Granted literature
- US20190382912A1 METHOD OF METAL POLISHING AND OXIDATION FILM PROCESS AND SYSTEM THEREOF Public/Granted day:2019-12-19
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