Invention Grant
- Patent Title: Adaptively opening cooling pathway
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Application No.: US15609529Application Date: 2017-05-31
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Publication No.: US10704399B2Publication Date: 2020-07-07
- Inventor: Benjamin Paul Lacy , Brian Peter Arness , Victor John Morgan , Stephen William Tesh
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Hoffman Warnick LLC
- Main IPC: F01D5/18
- IPC: F01D5/18 ; F01D5/28 ; F02B29/04

Abstract:
A hot gas path component of an industrial machine includes a cooling pathway. The component includes a body including an outer surface; a thermal barrier coating (TBC) over the outer surface, the TBC exposed to a working fluid having a high temperature; and an internal cooling circuit in the body carrying a cooling medium. A cooling pathway is in the body and in fluid communication with the internal cooling circuit. The cooling pathway includes a terminating end in the body and a length extending along and spaced internally from the outer surface by a first spacing. In response to a spall in the TBC occurring at a location over the cooling pathway and the high temperature reaching or exceeding a predetermined temperature of the body, the cooling pathway opens at the location through the first spacing to allow a flow of the cooling medium therethrough.
Public/Granted literature
- US20180347378A1 ADAPTIVELY OPENING COOLING PATHWAY Public/Granted day:2018-12-06
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