Invention Grant
- Patent Title: Loop heat pipe
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Application No.: US15678346Application Date: 2017-08-16
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Publication No.: US10704838B2Publication Date: 2020-07-07
- Inventor: Yoshihiro Machida , Nobuyuki Kurashima
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: IPUSA, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@31b33a5e
- Main IPC: F28D15/04
- IPC: F28D15/04 ; F28D15/02 ; H01L21/48 ; H01L23/427 ; H01L23/00

Abstract:
A loop heat pipe includes an evaporator that vaporizes working fluid; a condenser that condenses the working fluid; a liquid line that connects the evaporator and the condenser; a vapor line that connects the evaporator and the condenser to form a loop with the liquid line; and a porous body provided in the liquid line, and including a first metal layer that includes a first bottomed hole that is concaved from one surface of the first metal layer, and a second bottomed hole that is concaved from another surface of the first metal layer, the other surface being opposite of the one surface, the first bottomed hole and the second bottomed hole partially communicating with each other to form a pore.
Public/Granted literature
- US20180058767A1 LOOP HEAT PIPE Public/Granted day:2018-03-01
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