Invention Grant
- Patent Title: Plurality of boards mounted on image forming apparatus
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Application No.: US16410951Application Date: 2019-05-13
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Publication No.: US10705476B2Publication Date: 2020-07-07
- Inventor: Tatsuya Suzuki
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Venable LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@10089dd0
- Main IPC: G03G15/00
- IPC: G03G15/00 ; H01R12/52 ; H05K1/14 ; G03G15/20 ; H05K1/18

Abstract:
A first connector is soldered to a first board. A second connector is soldered to a second board. A third connector and a fourth connector are soldered to a relay board. The third connector is connected to the first connector via a first power line. The fourth connector is connected to the second connector via a second power line. A surface to which the first connector is soldered on the first board is opposite to a surface to which the first connector is attached on the first board. A surface to which the second connector is soldered on the second board is a surface to which the second connector is attached on the second board. Only surface-mount devices are used as electronic components soldered to the second board.
Public/Granted literature
- US20190361382A1 PLURALITY OF BOARDS MOUNTED ON IMAGE FORMING APPARATUS Public/Granted day:2019-11-28
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