Invention Grant
- Patent Title: Electronic device and method for checking dispensing of glue in relation to circuit board
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Application No.: US15854683Application Date: 2017-12-26
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Publication No.: US10706531B2Publication Date: 2020-07-07
- Inventor: Eddy Liu , Xi-Hang Li , Jun-Kang Fang
- Applicant: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD. , HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: CN Zhengzhou TW New Taipei
- Assignee: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Zhengzhou TW New Taipei
- Agency: ScienBiziP, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7c287c11
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06T7/13 ; H05K13/04 ; H05K13/08

Abstract:
A method for checking the proper dispensation of glue onto a circuit board in manufacture includes the use of fluorescent materials in such glue, activating a light source to illuminate a circuit board when the circuit board is placed on an electronic device, and controlling an image capturing device to capture an image of the circuit board. The image captured by the capturing device is compared with a standard stored image of the circuit board, and a determination is made as to whether the circuit board passes test according to the comparison.
Public/Granted literature
- US20180189940A1 ELECTRONIC DEVICE AND METHOD FOR CHECKING DISPENSING OF GLUE IN RELATION TO CIRCUIT BOARD Public/Granted day:2018-07-05
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