A semiconductor package including at least one integrated circuit component and a glue material is provided. The at least one integrated circuit component has a top surface with conductive terminals and a backside surface opposite to the top surface. The glue material encapsulates the at least one integrated circuit component, wherein a first lateral thickness of the glue material is smaller than a second lateral thickness of the glue material, the second lateral thickness is parallel to the first lateral thickness, and the first lateral thickness is substantially coplanar with the top surface.