Invention Grant
- Patent Title: Clip for semiconductor package
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Application No.: US16233518Application Date: 2018-12-27
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Publication No.: US10707147B2Publication Date: 2020-07-07
- Inventor: Ariel Sotomayor Tan
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Adam R. Stephenson, Ltd.
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/40 ; H01L23/00

Abstract:
Implementations of a clip may include a die attach portion including at least one protrusion extending from the die attach portion and a lead frame alignment portion including at least one alignment feature. The at least one alignment feature may be configured to couple into at least one hole in a lead frame thereby aligning the clip with the lead frame. The at least one protrusion may be configured to couple into at least one recess in the die.
Public/Granted literature
- US20190148263A1 CLIP FOR SEMICONDUCTOR PACKAGE Public/Granted day:2019-05-16
Information query
IPC分类: