A semiconductor device includes leads, a semiconductor element and a sealing resin covering the leads and the semiconductor element. The sealing resin includes an obverse surface, a reverse surface, and an end surface between the obverse surface and the reverse surface. The leads include a peripheral lead with a reverse surface exposed from the reverse surface of the resin and with an outer end surface exposed from the end surface of the resin. The outer end surface is located inward from the end surface of the resin. The sealing resin includes an interior top surface connected to its end surface and the outer end surface of the lead. The interior top surface and the reverse surface of the resin face in the same direction.