Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
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Application No.: US15993305Application Date: 2018-05-30
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Publication No.: US10707301B2Publication Date: 2020-07-07
- Inventor: Ryo Maeta
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-Shi, Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi, Kanagawa
- Agency: Rabin & Berdo, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6e43b249
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/761 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device has a termination structure region that includes a lower parallel pn structure having lower first-columns of a first conductivity type and lower second-columns of a second conductivity type; a center parallel pn structure having center first-columns of the first conductivity type and first rings of the second conductivity type; an upper parallel pn structure having upper first-columns of the first conductivity type and upper second-columns of the second conductivity type; and an uppermost parallel pn structure having uppermost first-columns of the first conductivity type and second rings of the second conductivity type. The first and second rings are wider than the lower second-columns. An interval between the first rings and between the second rings is wider than an interval between the lower second-columns. Positions of the first rings differ from positions of the second rings, along a direction parallel to a front surface of the semiconductor device.
Public/Granted literature
- US20190027555A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2019-01-24
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