Invention Grant
- Patent Title: MRAM structure for efficient manufacturability
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Application No.: US16425366Application Date: 2019-05-29
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Publication No.: US10707411B1Publication Date: 2020-07-07
- Inventor: Zining Wu , Winston Lee , Runzi Chang
- Applicant: Marvell International Ltd.
- Applicant Address: BM Hamilton
- Assignee: Marvell International Ltd.
- Current Assignee: Marvell International Ltd.
- Current Assignee Address: BM Hamilton
- Main IPC: H01L43/08
- IPC: H01L43/08 ; H01L43/12 ; H01L43/02 ; H01L27/22

Abstract:
A semiconductor device comprises a first conductive material, a contact, an a magnetic tunneling junction positioned between the first conductive material and the contact. The semiconductor device further comprises a spacer that is positioned between the first conductive material and the contact and surrounds at least a portion of the magnetic tunneling junction. The spacer comprises spacer material that has at least some etch selectivity compared to a dielectric material that surrounds at least a portion of the first conductive material.
Information query
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